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BC 817UPN E6327产品简介:
ICGOO电子元器件商城为您提供BC 817UPN E6327由Infineon设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供BC 817UPN E6327价格参考以及InfineonBC 817UPN E6327封装/规格参数等产品信息。 你可以下载BC 817UPN E6327参考资料、Datasheet数据手册功能说明书, 资料中有BC 817UPN E6327详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | TRANSISTOR ARRAY NPN AF 45V SC74两极晶体管 - BJT NPN Silicon AF TRANSISTOR ARRAY |
产品分类 | 晶体管(BJT) - 阵列分离式半导体 |
品牌 | Infineon Technologies |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 晶体管,两极晶体管 - BJT,Infineon Technologies BC 817UPN E6327- |
数据手册 | http://www.infineon.com/dgdl/bc817upn.pdf?folderId=db3a304314dca389011545f4eb561884&fileId=db3a304314dca3890115462f19751907 |
产品型号 | BC 817UPN E6327 |
不同 Ib、Ic时的 Vce饱和值(最大值) | 700mV @ 50mA,500mA |
不同 Ic、Vce 时的DC电流增益(hFE)(最小值) | 160 @ 100mA,1V |
产品种类 | 两极晶体管 - BJT |
供应商器件封装 | PG-SC74-6 |
其它名称 | BC 817UPN E6327CT |
功率-最大值 | 330mW |
包装 | 剪切带 (CT) |
发射极-基极电压VEBO | 5 V |
商标 | Infineon Technologies |
增益带宽产品fT | 170 MHz |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | SC-74,SOT-457 |
封装/箱体 | SC-74 |
工厂包装数量 | 3000 |
晶体管极性 | NPN/PNP |
晶体管类型 | NPN,PNP |
最大功率耗散 | 330 mW |
最大工作温度 | + 150 C |
最大直流电集电极电流 | 0.5 A |
最小工作温度 | - 65 C |
标准包装 | 1 |
电压-集射极击穿(最大值) | 45V |
电流-集电极(Ic)(最大值) | 500mA |
电流-集电极截止(最大值) | - |
直流电流增益hFE最大值 | 400 at 100 mA at 1 V |
直流集电极/BaseGainhfeMin | 160 |
系列 | BC 817UPN |
配置 | Dual |
集电极—发射极最大电压VCEO | 45 V |
集电极—基极电压VCBO | 50 V |
集电极—射极饱和电压 | 0.7 V |
集电极连续电流 | 500 mA |
零件号别名 | BC817UPNE6327HTSA1 SP000012398 |
频率-跃迁 | 170MHz |
BC817UPN NPN Silicon AF Transistor Array • For AF stages and driver applications 4 • High current gain 5 3 6 2 • Low collector-emitter saturation voltage 1 • Two (galvanic) internal isolated NPN/PNP transistors in one package • Pb-free (RoHS compliant) package • Qualified according AEC Q101 C1 B2 E2 Tape loading orientation 6 5 4 Top View Marking on SC74 package TR1 TR2 (for example W1s) 6 5 4 corresponds to pin 1 of device W1s 1 2 3 E1 B1 C2 12 3 Position in tape: pin 1 EHA07177 opposite of feed hole side Direction of Unreeling SC74_Tape Type Marking Pin Configuration Package BC817UPN 1Bs 1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SC74 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage V 45 V CEO Collector-base voltage V 50 CBO Emitter-base voltage V 5 EBO Collector current I 500 mA C Peak collector current, t ≤ 10 ms I 1000 p CM Base current I 100 B Peak base current I 200 BM Total power dissipation- P 330 mW tot T ≤ 115 °C S Junction temperature T 150 °C j Storage temperature T -65 ... 150 stg 1 2011-09-15
BC817UPN Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) R ≤ 105 K/W thJS Electrical Characteristics at T = 25°C, unless otherwise specified A Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage V 45 - - V (BR)CEO I = 10 mA, I = 0 C B Collector-base breakdown voltage V 50 - - (BR)CBO I = 10 µA, I = 0 C E Emitter-base breakdown voltage V 5 - - (BR)EBO I = 10 µA, I = 0 E C Collector-base cutoff current I µA CBO V = 25 V, I = 0 - - 0.1 CB E V = 25 V, I = 0 , T = 150 °C - - 50 CB E A Emitter-base cutoff current I - - 100 nA EBO V = 4 V, I = 0 EB C DC current gain2) h - FE I = 100 mA, V = 1 V 160 250 400 C CE I = 300 mA, V = 1 V 100 - - C CE Collector-emitter saturation voltage2) V - - 0.7 V CEsat I = 500 mA, I = 50 mA C B Base emitter saturation voltage2) V - - 1.2 BEsat I = 500 mA, I = 50 mA C B AC Characteristics Transition frequency f - 170 - MHz T I = 50 mA, V = 5 V, f = 100 MHz C CE Collector-base capacitance C - 6 - pF cb f = 1 MHz, V = 10 V BE Emitter-base capacitance C - 60 - eb V = 0.5 V, f = 1 MHz EB 1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation) 2Pulse test: t < 300µs; D < 2% 2 2011-09-15
BC817UPN DC current gain h = ƒ(I ) Collector-emitter saturation voltage FE C V = 1 V I = ƒ(V ), h = 10 CE C CEsat FE 10 3 103 BC 817/818 EHP00223 mA Ι C 150˚C 25˚C 102 -50˚C 5 E F h 10 2 101 5 105 °C 85 °C 65 °C 25 °C 100 -40 °C 5 10 1 10-1 10 -5 10 -4 10 -3 10 -2 10 -1 A 10 0 0 0.2 0.4 0.6 V 0.8 IC V CEsat Base-emitter saturation voltage Collector cutoff current I = ƒ(T ) CBO A I = ƒ(V ), h = 10 V = 25 V C BEsat FE CBO 103 BC 817/818 EHP00222 105 BC 817/818 EHP00221 mA nA Ι Ι C 150˚C CBO 25˚C 104 -50˚C 102 5 max 103 101 5 typ 102 100 101 5 10-1 100 0 1.0 2.0 3.0 V 4.0 0 50 100 ˚C 150 V T BEsat A 3 2011-09-15
BC817UPN Transition frequency fT = ƒ(IC) Collector-base capacitance Ccb = ƒ(VCB) VCE = parameter in V, f = 2 GHz Emitter-base capacitance Ceb = ƒ(VEB) 103 BC 817/818 EHP00218 65 pF MHz f T 5 55 50 B E C 45 /B C C 40 35 102 30 25 5 20 CEB 15 10 CCB 5 101 100 101 102 mA 103 00 2 4 6 8 10 12 14 16 V 20 Ι V /V C CB EB Total power dissipation P = ƒ(T ) Permissible Pulse Load R = ƒ(t ) tot S thJS p 10 3 400 K/W mW 300 10 2 S ot hJ Pt 250 Rt 200 10 1 D=0.5 0.2 150 0.1 0.05 100 10 0 0.02 0.01 0.005 50 0 00 20 40 60 80 100 120 °C 150 10 -11 0 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 T t S p 4 2011-09-15
BC817UPN Permissible Pulse Load P /P = ƒ(t ) totmax totDC p 10 3 C D D=0 Ptot 0.005 /x 0.01 ma 10 2 0.02 ot 0.05 Pt 0.1 0.2 0.5 10 1 10 0 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 t p 5 2011-09-15
Package SC74 BC817UPN Package Outline 2.9±0.2 B 1.1 MAX. (2.25) (0.35) 0.15-+00..016 6 5 4 ±0.1 ±0.1 X. X. ±0.1 5 5 A A 6 Pin 1 1 2 30.35+-00..015 0.2M B 6x 2. 0.2 10˚ M 0.1 MAX10˚ M. A1. marking 0.95 0.2M A 1.9 Foot Print 0.5 9 9 1. 2. 0.95 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 2005, June Date code (Year/Month) Pin 1 marking BCW66H Laser marking Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 4 0.2 8 7 2. Pin 1 3.15 1.15 marking 6 2011-09-15
BC817UPN Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 2011-09-15
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